Description

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The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

• The semiconductor industry
• Properties of semiconductor materials and chemicals
• Crystal growth and silicon wafer preparation
• Wafer fabrication and packaging
• Contamination control
• Productivity and process yields
• Oxidation
• The ten-step patterning process--surface preparation to exposure; developing to final inspection
• Next generation lithography
• Doping
• Layer deposition
• Metallization
• Process and device evaluation
• The business of wafer fabrication
• Devices and integrated circuit formation
• Integrated circuits
• Packaging

About the Author

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Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. He is the principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry. Van Zant's books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers have included Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions.